The goals are to reduce memory cost, and make the populated PCB even thinner. Combining more memory capacity with even thinner PCB QUICK WASHboards after mounting the memory chips means that the chips themselves must be as thin as possible. For standard PCB development, the thinner the chip is, the more USB connectordifficult it is to handle, which usually means a rise in manufacturing cost. However, if the memory can be embedded into the PCB, it becomeshand dryer possible to achieve a thinner main board even without machining centermaking the memory chips unduly thin. This could only be achieved by usingthe expertise of Samsung’s memory arm.SEMCO claims that developing and manufacturing passive components in-house also contributes to improved competitiveness for its device embedded PCBs. A source at R&Sthe firm explained “We make our own passive components, meaning it is a lot easier to design them specifically for use in device embedded PCBs."The use of specially RF PCBdesigned components also improves device embedded PCB reliability. Few Japanese board manufacturers make their own passives, and since the components weren’t optimized for embedding in boards, there have been mounting reliability problems such as poor connection reliability. It is thought that this type of problem is less likely to occur with SEMCO’s device embedded PCBs.